Job Search
This posting is managed by: | Michael Page International Japan K.K./マイケル・ペイジ・インターナショナル・ジャパン株式会社 |
---|---|
Company Name | Company is not publicly visible |
Job Type |
IT (Embedded Software, Control Systems) - Project Manager
|
Industry | Electronics, Components, and Semiconductor Manufacturing |
Location |
Asia
Japan
Tokyo
|
Job Description |
Lead product marketing efforts for advanced Digital Lithography Technology (DLT) tools, targeting back-end packaging processes for innovative copper clad laminate (CCL) circuit boards. Collaborate with global partners, including a leading technology provider, to drive market penetration and shape the future of semiconductor packaging. Description * Develop comprehensive business and marketing plans to drive competitive advantage and market share. * Conduct detailed competitive analysis for specific product lines in Advanced Packaging. * Establish pricing strategies and develop marketing tools for successful product introductions. * Collaborate with cross-functional teams to develop and enhance products, and communicate critical market needs. * Manage field support to optimize account partnerships and penetration opportunities. Profile * Possesses 5+ years of hands-on experience in semiconductor tool engineering, preferably in back-end packaging or front-end fab processes. * Demonstrates strong technical knowledge and problem-solving skills, with the ability to communicate effectively with both internal and external stakeholders. * Fluent in English, with proficiency in Japanese considered a plus. Job Offer * * Competitive salary ranging from 9 to 15 million (total). * Opportunity for international travel (50% domestic), excluding Okinawa and Hokkaido. * Reporting directly to a non-Japanese Managing Director based in the US. * First position in Japan, offering autonomy and leadership in a standalone role. * Chance to influence the direction of cutting-edge technologies and shape the future of semiconductor packaging. To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Maika Someda on +81 3 6832 8682. |
Company Info | Our client is a renowned player in the semiconductor industry, driving innovation and pushing boundaries in advanced packaging technologies. With a global presence and a commitment to excellence, they offer a dynamic environment where talented professionals can thrive and make a significant impact. |
Working Hours | 詳しくはお問い合わせください |
Job Requirements |
Possesses 5+ years of hands-on experience in semiconductor tool engineering, preferably in back-end packaging or front-end fab processes. Demonstrates strong technical knowledge and problem-solving skills, with the ability to communicate effectively with both internal and external stakeholders. Fluent in English, with proficiency in Japanese considered a plus. |
English Level | Fluent (TOEIC 865-) |
Japanese Level | Native Level |
Salary | JPY - Japanese Yen JPY 9000K - JPY 15000K |
Recruiter
Michael Page International Japan K.K./マイケル・ペイジ・インターナショナル・ジャパン株式会社