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Product Marketing Manager - Global Semiconductor - Up to 15M | マイケル・ペイジ・インターナショナル・ジャパン株式会社/Michael Page International Japan K.K.の求人詳細

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keyvisual
更新日 2024-06-21
掲載開始日 2024-06-21

Product Marketing Manager - Global Semiconductor - Up to 15M

  • 人材紹介
  • スタッフレベル
この求人の
取扱い会社
マイケル・ペイジ・インターナショナル・ジャパン株式会社/Michael Page International Japan K.K.
企業名 会社名非公開
職種
マイケル・ペイジ・インターナショナル・ジャパン株式会社/Michael Page International Japan K.K.
IT関連(組込み/制御系) - プロジェクトマネージャー
業種 半導体・電気・電子部品メーカー
勤務地 アジア 日本 東京都

仕事内容 Lead product marketing efforts for advanced Digital Lithography Technology (DLT) tools, targeting back-end packaging processes for innovative copper clad laminate (CCL) circuit boards. Collaborate with global partners, including a leading technology provider, to drive market penetration and shape the future of semiconductor packaging.


Description

* Develop comprehensive business and marketing plans to drive competitive advantage and market share.
* Conduct detailed competitive analysis for specific product lines in Advanced Packaging.
* Establish pricing strategies and develop marketing tools for successful product introductions.
* Collaborate with cross-functional teams to develop and enhance products, and communicate critical market needs.
* Manage field support to optimize account partnerships and penetration opportunities.


Profile

* Possesses 5+ years of hands-on experience in semiconductor tool engineering, preferably in back-end packaging or front-end fab processes.
* Demonstrates strong technical knowledge and problem-solving skills, with the ability to communicate effectively with both internal and external stakeholders.
* Fluent in English, with proficiency in Japanese considered a plus.


Job Offer

*

* Competitive salary ranging from 9 to 15 million (total).
* Opportunity for international travel (50% domestic), excluding Okinawa and Hokkaido.
* Reporting directly to a non-Japanese Managing Director based in the US.
* First position in Japan, offering autonomy and leadership in a standalone role.
* Chance to influence the direction of cutting-edge technologies and shape the future of semiconductor packaging.


To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Maika Someda on +81 3 6832 8682.
企業について
(社風など)
Our client is a renowned player in the semiconductor industry, driving innovation and pushing boundaries in advanced packaging technologies. With a global presence and a commitment to excellence, they offer a dynamic environment where talented professionals can thrive and make a significant impact.
勤務時間 詳しくはお問い合わせください
応募条件 Possesses 5+ years of hands-on experience in semiconductor tool engineering, preferably in back-end packaging or front-end fab processes.
Demonstrates strong technical knowledge and problem-solving skills, with the ability to communicate effectively with both internal and external stakeholders.
Fluent in English, with proficiency in Japanese considered a plus.
英語能力 流暢 (TOEIC 865点以上)
日本語能力 ネイティヴレベル
年収 日本・円 900万円 〜 1500万円   
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