Product Marketing Manager - Global Semiconductor - Up to 15M | マイケル・ペイジ・インターナショナル・ジャパン株式会社/Michael Page International Japan K.K.の求人詳細

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2024.5.24 [Fri.]

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更新日 2024-05-13
掲載開始日 2024-05-13

Product Marketing Manager - Global Semiconductor - Up to 15M

人材紹介
スタッフレベル

この求人の取扱い会社	マイケル・ペイジ・インターナショナル・ジャパン株式会社/Michael Page International Japan K.K.
企業名	会社名非公開
職種	IT関連（組込み/制御系） - プロジェクトマネージャー
業種	半導体・電気・電子部品メーカー
勤務地	アジア日本東京都
仕事内容	Lead product marketing efforts for advanced Digital Lithography Technology (DLT) tools, targeting back-end packaging processes for innovative copper clad laminate (CCL) circuit boards. Collaborate with global partners, including a leading technology provider, to drive market penetration and shape the future of semiconductor packaging. Description * Develop comprehensive business and marketing plans to drive competitive advantage and market share. * Conduct detailed competitive analysis for specific product lines in Advanced Packaging. * Establish pricing strategies and develop marketing tools for successful product introductions. * Collaborate with cross-functional teams to develop and enhance products, and communicate critical market needs. * Manage field support to optimize account partnerships and penetration opportunities. Profile * Possesses 5+ years of hands-on experience in semiconductor tool engineering, preferably in back-end packaging or front-end fab processes. * Demonstrates strong technical knowledge and problem-solving skills, with the ability to communicate effectively with both internal and external stakeholders. * Fluent in English, with proficiency in Japanese considered a plus. Job Offer * * Competitive salary ranging from 9 to 15 million (total). * Opportunity for international travel (50% domestic), excluding Okinawa and Hokkaido. * Reporting directly to a non-Japanese Managing Director based in the US. * First position in Japan, offering autonomy and leadership in a standalone role. * Chance to influence the direction of cutting-edge technologies and shape the future of semiconductor packaging. To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Maika Someda on +81 3 6832 8682.
企業について（社風など）	Our client is a renowned player in the semiconductor industry, driving innovation and pushing boundaries in advanced packaging technologies. With a global presence and a commitment to excellence, they offer a dynamic environment where talented professionals can thrive and make a significant impact.
勤務時間	詳しくはお問い合わせください
応募条件	Possesses 5+ years of hands-on experience in semiconductor tool engineering, preferably in back-end packaging or front-end fab processes. Demonstrates strong technical knowledge and problem-solving skills, with the ability to communicate effectively with both internal and external stakeholders. Fluent in English, with proficiency in Japanese considered a plus.
英語能力	流暢 (TOEIC 865点以上)
日本語能力	ネイティヴレベル
年収	日本・円 900万円〜 1500万円