The scope includes design and optimization of Chipset PCB Floorplan, Schematic, Layout, Device thermal solution and eBOM selection for specific projects.
The engineer is required to perform the required board level simulations (based on Power Integrity and Signal Integrity tools) to review and sign off on hardware designs developed by teams.
The engineer will be responsible for characterizing and publishing performance and cost optimized reference BOM lists (power inductors, capacitors, third party components, etc.) based on component characterization ...
* Globally contributes to innovation for product, application, process & technology.
* Supports the profitable business growth with all resources available at Technology Team (Applied Technology, Product Development, Process Development, CAE, Material Evaluation & Analysis Lab,Part Testing Lab, Composites Lab, etc.)
* Globally contributes to innovation for product, application, process & technology
* Globally explores and develops new businesses opportunities
* Manages initiatives, leads & develop people in Technology Team
* R ...